On May 6, Huasun Xuancheng Phase II Silicon Wafer Project's First Equipment Move-In Ceremony was held in Xuancheng Science and Technology Park.
Mr. Zhou Dan, CEO of Huasun Energy, said, "The photovoltaic industry has always been committed to reducing the LCOE. Through introducing the advanced technologies such as tungsten diamond wire cutting and ultra-thin semi-cutting technology, Huasun Silicon wafer Phase II project will further reduce the wafer cost, improve product yield, effectively improve cell efficiency, and create more opportunities for cost reduction and efficiency increase.”
Huasun Xuancheng Silicon wafer Phase II project has a planned production capacity of 2.7GW, mainly producing silicon wafers for HJT. The silicon wafers produced by the tungsten diamond wire cutting technology can meet the basic demands of thinner and smaller tolerances for HJT cells. It will provide sustained power to produce high-efficient HJT solar cells from the wafer end.